Telecommunications

Signal Integrity at the Speed of Innovation

From 5G infrastructure and base stations to RF modules and optical networking, today’s telecom hardware demands low-loss, high-frequency, and thermally stable PCBs—and that’s exactly what Insight PCB delivers.

With decades of fabrication experience and advanced capabilities in controlled impedance, RF materials, and HDI stackups, we support OEMs and EMS providers building the backbones of global communication.

Whether you’re working on small form-factor modules or high-density transceivers, we offer materials and stackups engineered to reduce insertion loss, control signal integrity, and meet the strict performance requirements of modern telecom networks.

Telecommunications PCB Capabilities:

  • Low-loss materials (e.g., Rogers, Isola, Taconic, Panasonic, Nelco) for RF & microwave
  • Controlled impedance stackups for high-speed signal routing
  • HDI with blind/buried vias and laser-drilled microvias for compact layouts
  • VIPPO (via-in-pad plated over) for dense BGA placement
  • Backdrilling to eliminate stubs and reduce signal reflections
  • Metal core and heavy copper options for thermal management in power amplifiers
  • High layer counts — up to 35 layers — for dense network hardware
  • IPC Class 3 production standards, RoHS/UL approved
  • Certified to ISO 9001, ISO 14001, AS9100D, IATF 16949

Used in:

  • 5G Base Stations and Infrastructure
  • RF Front-End Modules
  • Network Switches and Routers
  • Optical Transceivers and NICs
  • Telecom Power Supply Boards
  • Microwave Backhaul Systems
  • Fiber Optic Control & Distribution Units

As telecom networks evolve to support faster speeds, lower latency, and higher bandwidth, Insight PCB stands ready to support the infrastructure with reliable, high-performance circuit boards that keep the world connected.