Capabilities
Minimum material thickness
.0025
IPC-2223 Type I, II, and III Capabilities
Layer Count
0 – 35 layers
Turn Time
7 days – 4 weeks
Quantity
1 – 10,000+
Materials
FR-4/Rogers/Polyimide/Metal Core/Special Materials
Plating Finish
ENIG/Gold/Nickel/Immersion Silver/OSP/Lead-Free HASL
Board Thickness
.031 – .250
Copper Weight
Inner: .5 oz – 4 oz Outer: 1 – 6 oz
Trace and Space Width
3 mils
Minimum Hole Size
± 0.002’’
Hole Tolerance
± 0.005’’
Slots/Cutouts/Edges
Plated / Non-plated
UL Marking
*on UL approved materials
Stacked Vias
Gold Fingers
Scoring
Castellated Holes
Controlled Dielectric
Controlled Impedance
Controlled Impedance Tolerance
Countersinks / counter bores
Blind / buried vias
Mask-plugged vias
Via-In-Pad
Stacked Via
Conductive and Non-conductive Epoxy
Copper Filled Microvia
Etch Back
Cover Coat
Laser Rout
Edge Mill
Serialization
Back Drilling
Controlled Depth Drilling
Controlled V-Score