HDI PCBs (High-Density Interconnect)

Compact. Fast. Built for Next-Gen Performance.

At Insight PCB, we manufacture HDI PCBs designed for advanced electronics that demand compact form factors, high-speed signal integrity, and reliable multilayer routing. Our HDI technology supports fine-pitch BGA breakout, high signal density, and low-loss performance for today’s most challenging applications—from IoT to aerospace.

Why Choose Insight PCB as Your HDI PCB Manufacturer

Advanced Expertise in HDI Fabrication

At Insight PCB, we specialize in high-density interconnect (HDI) PCB fabrication, leveraging over three decades of expertise to support miniaturized, high-performance electronics. Our team provides engineering guidance, design-for-manufacturability reviews, and advanced stack-up solutions tailored to your needs.

Microvia, Blind & Buried Via Capabilities

We offer laser-drilled microvias, blind and buried vias, and via-in-pad plated over (VIPPO) technologies to maximize routing density and signal integrity in compact board designs.

Certified for High-Precision and Reliability (IPC-2226, ISO, AS9100D)

Our HDI processes meet the strictest industry certifications, including IPC-2226 standards, ISO 9001, ISO 14001, AS9100D, IATF16949, UL, and RoHS compliance. This ensures unmatched quality for aerospace, medical, and defense-grade products.

What Is an HDI PCB? Understanding HDI PCB Technology

IPC-2226 Definition: Trace, Via & Pad Thresholds

According to IPC-2226 standards, HDI boards are defined by fine features: trace/space dimensions ≤ 100 µm (1.5 mil), high pad density, and stacked or staggered microvia technology.

Microvias & Sequential Lamination Explained

Laser-drilled microvias enable vertical interconnects with minimal space requirements. Using sequential lamination, we support Type I, II, and III HDI builds that integrate buried vias, stacked microvias, and complex copper-filled structures.

HDI vs Conventional PCBs: Key Technical Differences

Compared to conventional PCBs, HDI designs offer increased I/O density, reduced layer counts, enhanced signal speed, and improved thermal management—ideal for modern IoT and AI-driven devices.

HDI PCB Capabilities & Fabrication Details

Trace/Space Capabilities Down to ≤ 100 µm (or 1.5 mil)

Our facilities are equipped for ultra-fine line processing, supporting signal speeds and miniaturization that conventional boards cannot handle.

Multi-Layer Build-Up (Type I, II & III HDI)

We support complex sequential lamination for Type I, II, and III HDI stack-ups, enabling increased routing density without enlarging the PCB footprint.

Via-In-Pad, Controlled Impedance & Fine-Line Routing

Via-in-pad technology with non-conductive via fill and plating ensures signal integrity for high-speed applications. Controlled impedance routing is applied for RF and digital circuits.

Benefits of HDI PCBs from Insight PCB

Compact, Lightweight Design with Increased Functionality

HDI enables smaller, thinner, and lighter boards while increasing circuit density—perfect for consumer electronics and wearables.

Improved Signal Integrity & Reduced Electromagnetic Interference

Shorter trace lengths and optimized copper distribution result in better electrical performance and reduced EMI.

Lower Layer Counts with Higher Routing Efficiency

HDI boards often require fewer layers than conventional designs, providing cost savings without compromising performance.

Industries Served by Us

Consumer Electronics: Smartphones, Tablets, Wearables

From next-gen smartphones to smartwatches, HDI is the backbone of compact, lightweight devices.

Aerospace, Defense & Avionics

Mission-critical systems demand high-reliability HDI PCBs with superior thermal and vibration resistance.

Medical, Automotive & Telecom High-Density Designs

Applications include medical imaging, ADAS systems in vehicles, and 5G telecom infrastructure.

Design & Quality Assurance for HDI PCB Manufacturing

DFM Review & Stack-Up Guidance from Engineering Team

Our engineers provide design-for-manufacturability (DFM) support, ensuring cost-effective stack-up design and manufacturability.

Material Selection (High-TG Laminates, Copper Foil Precision)

We source high-TG laminates, VLP/HVLP copper foils, and low-loss dielectric materials optimized for high-speed applications.

IPC-Standard Testing, Thermal & Signal Integrity Validation

All HDI boards undergo IPC-standard testing, including thermal cycling, electrical testing, and signal integrity validation.

From Prototype to Volume Production with Expert HDI PCB Support

Rapid Turn Prototyping & Technical Consultations

We provide fast prototyping services for proof-of-concept designs, enabling rapid product development cycles.

Volume Production Scale & Global Logistics Coordination

With global capacity, we scale from prototype to high-volume production with supply chain flexibility.

ASP-Driven Communication: Quotes, File Checks, Delivery Assurance

Our automated sales process (ASP) ensures seamless quoting, design verification, and logistics updates—keeping your projects on schedule.

Request a Quote from Your HDI PCB Supplier

Submit Specs & Receive a Fast, Customized Estimate

Upload your Gerber files or ODB++ data and receive a quick, tailored quotation.

Consultation Available for Complex Designs & Stack-Up Plans

Our engineering team is available for stack-up consultations and complex HDI design support.

Lead Time & Shipping Options for Global Clients

We offer flexible lead times and international shipping options, ensuring on-time delivery worldwide.