HDI PCBs (High-Density Interconnect)

Compact. Fast. Built for Next-Gen Performance.

At Insight PCB, we manufacture HDI PCBs designed for advanced electronics that demand compact form factors, high-speed signal integrity, and reliable multilayer routing. Our HDI technology supports fine-pitch BGA breakout, high signal density, and low-loss performance for today’s most challenging applications—from IoT to aerospace.

What Is HDI?

High-Density Interconnect (HDI) boards use microvias, fine traces, and sequential lamination to increase routing density and enable designs with more I/Os in smaller spaces. They are ideal for compact, high-speed systems where conventional PCBs fall short.

Our HDI Capabilities

  • Microvias (laser drilled, 0.1 mm typical)
  • Skip-vias and staggered/built-up layers
  • Blind & buried vias using sequential lamination
  • Via-in-Pad with non-conductive fill and plating over (VIPPO)
  • Controlled-depth drilling for blind mechanical vias
  • Backdrilling to remove unused via stubs
  • Low-loss laminate systems and HVLP/VLP copper foils
  • Stackups with 3+N+3, any-layer interconnect (ALIVH), or mixed dielectric systems

Advantages of HDI

  • Increased electrical performance
    Shorter wire lengths reduce inductance, signal delay, and power loss
  • Reduced board size & layer count
    Ideal for miniaturized systems using via-in-pad and narrow trace/space rules
  • Improved reliability
    Tighter process control and reduced via count = fewer failure points
  • Enhanced BGA breakout
    Supports fine-pitch components, including <0.4 mm pitch BGAs
  • Thermal & mechanical optimization
    Embedded vias and strategic routing improve heat dissipation and z-axis stiffness

Additional Technical Insights

Buried Vias

Buried vias are created with drilled and plated internal cores or sequentially laminated sublayers. While they improve interconnection density, they involve multiple lamination cycles and should be applied with careful cost-performance balance.

Laser Drilling

Our precision laser ablation systems form clean, copper-etched microvias as small as 0.004″ (0.10 mm). We also support full copper plating or copper-fill for enhanced conductivity and reliability.